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TWO PORT RECIPROCITY CST MICROWAVE STUDIO FREE
Solder mask substrate on top and bottom is also defined by using loss free dielectric type with εr = 3.6.įour shorting vias connecting the two power (PWR) planes are also modeled in order to investigate their impact on the return loss.įigure 1 - CST MICROWAVE STUDIO model of a single-ended via connecting two short microstriplines. The used materials are copper (σ = 5.8e7 S/m) for the metal parts and FR4 isola (εr = 4.19 loss free) for the dielectric. Parameter definition and preliminary settingsĪ single-ended via hole connecting 100mils long microstriplines located on the top and on the bottom of a multilayer PCB is illustrated in Figure 1. The main cause of signal integrity problems is noise induced by neighboring connections, or cross-talk. Alternatively, signal integrity tools attempt to identify and remove effects that cause a design to malfunction due to distortion of the signal wave forms. In other words, signal integrity refers to electronic circuit tools and techniques which ensure that electrical signals are of sufficient quality for proper operation. Electronic signals, particularly high speed signals will deteriorate, distort or oscillate if the designer has not made allowances for impedance matching and signal transmission effects. In general, signal integrity refers to the quality of an electrical signal or pulse on the interconnect track of a PCB or component. ContentsĬonclusion Introduction Physical Description A methodology is presented in this tutorial for the analysis and the characterization of a simple via hole in multilayer PCB. For this reason an accurate modeling of discontinuities at PCB level is essential for signal integrity (SI) analysis.
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The layout of printed circuit boards (PCBs) involves a large number of discontinuities, and their presence causes signal distortion and all the related problems for the mounted digital devices. The miniaturization and the large-scale integration of electronic devices place increasing demand on the multilayer interconnect geometry.